Chomerics, a division of Parker Hannifin Corp., is a global provider of Thermal and EMI management materials and services to the OEM and CEM electronics companies for telecommunications, information technologies, consumer, power conversion, defense, and transportation markets.

Chomerics offers an extensive family of thermal interface materials, which transfer heat from electronic components to heat sinks. Careful management of thermal interfaces is crucial to maintaining the reliability and extending the life of electronic devices and equipment. As each new electronic product generation requires higher power in smaller packages, the challenges associated with thermal management becomes more intense.

Thermal Material Drivers include:

• Lower thermal impedance
• Higher thermal conductivity
• Greater conformability
• High reliability
• Greater adhesion
• Ease of handling and use of application
• Long service life

Thermal Management Products

• Gap filler pads
• Silicone-free pads
• Phase-change insulator pads
• Adhesive attachment tape pads
• Thin flexible heat spreaders
• Custom intergraded thermal & EMI assemblies
• Dispensable gap fillers & gels
• Dispensable compounds potting

Chomerics products have been designed into thousands of applications to help ensure the performance, integrity, survivability, and maintainability of communications equipment, radar, aircraft, computers, control systems, telecommunication, consumer devices, automotive, and industrial electronics. Our customers are supported with comprehensive applications engineering, supply chains and fabrication services, like Marian Inc., worldwide.