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Thermal Management Materials: Thermally conductive adhesives, gap fillers, insulator pads, heat spreaders, Chomerics distributor |
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Thermal Management Materials
Electronic devices get smaller with each new model. Microchip processing speeds grow exponentially every year. The challenge for designers is what to do with the heat byproduct of these size and speed technology advancements.The thermally conductive materials offered by Marian handle this problem by moving heat away from sensitive components toward the ambient environment.
Available thermal management products include heat sink insulators; phase change; thermal attachment tapes; thermally conductive elastomers, adhesives and pressure-sensitive tapes; heat spreaders; silicon compounds; gap fillers and insulator pads.
Manufacturers
What you see listed here is far from comprehensive. Talk with us about your application and together we’ll seek a simple, cost-effective solution. If you need a material sample, please submit your request and we’ll be happy to send you more information. |